HBM4
HBM4 (High Bandwidth Memory 4) is a JEDEC HBM memory generation from 2026, with 1,740 GB/s of bandwidth per stack.
Built from BenchGecko data as of April 14, 2026 · updates when the data changes
HBM4 (High Bandwidth Memory 4) is a JEDEC HBM memory generation from 2026, with 1,740 GB/s of bandwidth per stack.
Basic
Next-generation HBM doubling interface width to 2048-bit. Enables 1.74 TB/s per stack. Targeted at NVIDIA Rubin and AMD next-gen. SK hynix sampling to customers, Samsung and Micron in development. First volume expected late 2026. Status in the dataset: development.
Deep
Interface width is 2,048 bits at 1.1 V. Capacity per stack: 36, 48 GB, up to 16-high stacks. Suppliers: SK hynix (sampling), Samsung (development) and Micron (development). Main buyers: NVIDIA, AMD and Google.
Expert
AI accounts for about 95% of its demand in the dataset. All figures are dated with the curated memory dataset; see the memory page for sources.
Depending on why you're here
- ·1,740 GB/s per stack · 2,048-bit interface
- ·JEDEC HBM · 2026
- ·Capacity per stack: 36, 48 GB
- ·Compare generations on /memory/hbm4
- ·Suppliers: SK hynix, Samsung and Micron
- ·Price trend: unknown
- ·HBM4 is a type of memory chip
- ·It sits right next to AI chips and feeds them data very fast
Frequently Asked Questions
Read the primary sources
- SK hynix HBM4 announcementnews.skhynix.com
- JEDEC HBM4 specwww.jedec.org