HBM3
HBM3 (High Bandwidth Memory 3) is a JEDEC HBM memory generation from 2022, with 819 GB/s of bandwidth per stack.
Built from BenchGecko data as of April 14, 2026 · updates when the data changes
HBM3 (High Bandwidth Memory 3) is a JEDEC HBM memory generation from 2022, with 819 GB/s of bandwidth per stack.
Basic
First JEDEC HBM3 generation with 1024-bit interface. Powers NVIDIA H100 and H200, AMD MI300X, Google TPU v5e, AWS Trainium. SK hynix was sole initial supplier for H100. Mature production with stable supply as demand shifts to HBM3e. Status in the dataset: volume.
Deep
Interface width is 1,024 bits at 1.1 V. Capacity per stack: 16, 24 GB, up to 12-high stacks. Suppliers: SK hynix (volume), Samsung (volume) and Micron (volume). Main buyers: NVIDIA, AMD, Google and AWS.
Expert
The dataset prices it at about $16 per GB (-8% year over year), trend declining. AI accounts for about 80% of its demand in the dataset. All figures are dated with the curated memory dataset; see the memory page for sources.
Depending on why you're here
- ·819 GB/s per stack · 1,024-bit interface
- ·JEDEC HBM · 2022
- ·Capacity per stack: 16, 24 GB
- ·Compare generations on /memory/hbm3
- ·Suppliers: SK hynix, Samsung and Micron
- ·Price trend: declining
- ·HBM3 is a type of memory chip
- ·It sits right next to AI chips and feeds them data very fast
Frequently Asked Questions
Read the primary sources
- JEDEC HBM3 specificationwww.jedec.org
- SK hynix HBM3 product briefproduct.skhynix.com