HBM3e
HBM3e (High Bandwidth Memory 3e (Enhanced)) is a JEDEC HBM memory generation from 2024, with 1,180 GB/s of bandwidth per stack.
Built from BenchGecko data as of April 14, 2026 · updates when the data changes
HBM3e (High Bandwidth Memory 3e (Enhanced)) is a JEDEC HBM memory generation from 2024, with 1,180 GB/s of bandwidth per stack.
Basic
The dominant HBM generation for 2024-2026 AI training. Enhanced version of HBM3 with higher per-pin data rate (9.6 Gbps). Powers NVIDIA B200, GB200, GB300, AMD MI325X/MI355X, and hyperscaler ASICs. SK hynix leads production, Samsung struggling with yields, Micron validated for NVIDIA. Status in the dataset: volume.
Deep
Interface width is 1,024 bits at 1.1 V. Capacity per stack: 24, 36 GB, up to 12-high stacks. Suppliers: SK hynix (volume), Samsung (ramping) and Micron (volume). Main buyers: NVIDIA, AMD, Google, AWS, Microsoft and Meta.
Expert
The dataset prices it at about $25 per GB (+45% year over year), trend rising. AI accounts for about 90% of its demand in the dataset. All figures are dated with the curated memory dataset; see the memory page for sources.
Depending on why you're here
- ·1,180 GB/s per stack · 1,024-bit interface
- ·JEDEC HBM · 2024
- ·Capacity per stack: 24, 36 GB
- ·Compare generations on /memory/hbm3e
- ·Suppliers: SK hynix, Samsung and Micron
- ·Price trend: rising
- ·HBM3e is a type of memory chip
- ·It sits right next to AI chips and feeds them data very fast
Frequently Asked Questions
Read the primary sources
- SK hynix Q4 2025 earningswww.skhynix.com
- TrendForce HBM market report Q1 2026www.trendforce.com
- Samsung HBM3e qualification timelinesemiconductor.samsung.com
- Micron NVIDIA validation disclosureinvestors.micron.com