ChipsReading · ~3 min · 50 words deep

MI300X

MI300X is an AMD GPU based on the CDNA 3 chiplet architecture, first released in 2023.

Built from BenchGecko data as of April 14, 2026 · updates when the data changes

MI300X spec page
TL;DR

MI300X is an AMD GPU based on the CDNA 3 chiplet architecture, first released in 2023.

Spec card · data as of Apr 14, 2026
Full hardware page
Peak FP8
2,614 TFLOPS
Peak FP16/BF16
1,307 TFLOPS
Memory
192 GB HBM3
Bandwidth
5.3 TB/s
TDP
750 W
Process
N5+N6 · TSMC
Released
2023
Status
shipping
Level 1

The AMD Instinct MI300X is an AI GPU made by AMD, codenamed Aqua Vanjaram. Peak throughput is 1,307 TFLOPS at FP16/BF16 and 2,614 TFLOPS at FP8. It carries 192 GB of HBM3 with 5.3 TB/s of memory bandwidth. Rated power (TDP) is 750 W. It is built on N5+N6 at TSMC.

Level 2

In the BenchGecko dataset it sits in the mainstream tier: current-generation non-flagship parts or last-generation flagships still widely deployed. It is followed by the MI325X. Disclosed buyers include Microsoft and Meta. Specs come from manufacturer datasheets; the spec card on this page shows the dataset values and their as-of date.

Level 3

That is 1.74 FP16 TFLOPS per watt. Memory bandwidth per unit of compute is 4.06 GB/s per FP16 TFLOP: a higher ratio helps memory-bound inference, while peak TFLOPS matter more for compute-bound training. Fabrication: Taiwan. Real throughput depends on the model, precision, batch size and software stack, so compare tokens per second per dollar for your own workload.

The takeaway for you
If you are a
Researcher
  • ·MI300X: 1,307 TFLOPS FP16/BF16 · 2,614 TFLOPS FP8
  • ·Process: N5+N6 at TSMC
  • ·Tier: mainstream
If you are a
Builder
  • ·192 GB of HBM3 per chip
  • ·Cloud availability in the dataset: Azure, RunPod and TensorWave
  • ·Compare it with other chips on /hardware/mi300x
If you are a
Investor
  • ·Disclosed buyers: Microsoft and Meta
  • ·AMD · fabbed at TSMC
  • ·Supply tightness is tracked on /hardware
If you are a
Curious · Normie
  • ·MI300X is a chip built to run AI, made by AMD
  • ·It has 192 GB of fast memory so large models fit
  • ·Companies buy or rent these to train and serve AI models
MI300X is an AMD GPU based on the CDNA 3 chiplet architecture, first released in 2023. Peak throughput is 1,307 TFLOPS at FP16/BF16 and 2,614 TFLOPS at FP8. It carries 192 GB of HBM3 with 5.3 TB/s of memory bandwidth. Rated power (TDP) is 750 W.
Canonical sources